TESDD5V0 bi-directional esd protection diode small signal diode ? meet iec61000-4-4 (eft) rating. 40a (5/50 ?s) ? protects one birectional i/o line ? working voltage : 5v min max min max ? case : sod-523f flat lead small outline plastic package 0.70 0.90 0.028 0.035 1.50 1.70 0.059 0.067 0.25 0.35 0.010 0.014 1.10 1.30 0.043 0.051 0.60 0.70 0.024 0.028 0.10 0.14 0.004 0.006 pin configutation ? notebooks, desktops, and servers ? keypads, side keys, usb 2.0, lcd displays ? portable instrumentation suggested pad layout ? microprocessor based equipment part no. package packing marking TESDD5V0 sod-523f 3k / 7" reel dt maximum ratings and electrical characteristics maximum ratings electrical characteristics 1ma 5v 1a 3a sod-523f notes: 1. the suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application. dimensions a b c d e f ordering information packing code rkg unit (mm) ? pb free version, rohs compliant, and halogen free mechanical data -1 5 9.8 1 6 100 15 8 - pf w c v v kv units v ua rating at 25 c ambient temperature unless otherwise specified. applications ? cell phone handsets and accessories ? weight :2 mg (approximately) - symbol value . -55 to + 150 . min symbol v esd p pp units ? terminal: matte tin plated, lead free., solderable per mil-std-202, method 208 guaranteed ? meet iec61000-4-2 (esd) 15kv (air), 8kv (contact) ? marking code : dt ? mounting position: any unit (inch) reverse breakdown volta peak pulse power (tp=8/20 s waveform) ? high temperature soldering guaranteed: 260 c/10s 5 v rwm t j , t stg junction and storage temperature range type number esd per iec 61000-4-2 (air) esd per iec 61000-4-2 (contact) junction capacitance i pp = v r = type number reverse stand-off voltage i pp = v r =0v, f=1.0mhz reverse leakage curren i r = - vc features 13 (typ.) clamping voltage - c j i r v (br) max 0.40 0.40 1.80 1.00 unit : mm version : c11
TESDD5V0 bi-directional esd protection diode small signal diode rating and characteristic curves 0.01 0.1 1 10 0.1 1 10 100 1000 peak pulse power ppp (kw) pulse duration (us) fig 2 pulse waveform 0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 25 30 percent of i pp time (us) td=ipp/2 ambient tempeatature ( o c) reverse voltage (v) 0 5 10 15 20 25 0123456 clamping voltage (v) fig 5 clamping voltage vs. peak pulse current) peak pulse current (a) waveform parameters: tr = 8 s, td = 20 s fig 1 non-repetitive peak pulse power vs. pulse time waveform parameters: tr = 8 s, td = 20 s fig 4 typical junction capacitance 0 5 10 15 012345 normalized capacitance fig 3 admissible power dissipation curve 0 20 40 60 80 100 120 0 20 40 60 80 100 120 140 160 180 power rating (%) f = 1.0mhz 1000 e -1 version : c11
TESDD5V0 bi-directional esd protection diode small signal diode applications information ? designed to protect sensitive electronics from damage or latch-up due to esd ? designed to replace multilayer varistors (mlvs) in portable applications ? offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to mlvs circuit board layout recommendations tape & reel specification note 1: a 0 , b 0, and k 0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. the component cannot rote more than 10o within the determined cavity. note 2: if b1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. overall tape thickness t 0.6 max. tape width w 8.30 max. reel width w1 14.4 max. sprocke hole pitch p0 4.00 0.10 embossment center p1 2.00 0.10 sprocke hole position e 1.75 0.10 punch hole position f 3.50 0.05 reel inner diameter d1 50 min. feed hole width d2 13.0 0.5 sprocket hole d 1.50 +0.10 reel outside diameter a 178 1 item symbol dimension (mm) ? minimize the path length between the esd protection diode and the protected line. ? minimize all conductive loops including power and ground loops. ? designed to protect one data, i/o, or power supply line. ? the combination of small size and high esd surge capability makes them ideal for use in portable applications. good circuit board layout is critical for the suppression of esd induced transients. ? place the esd protection diode near the input terminals or connectors to restrict transient coupling. carrier depth k 2.40 max. ? the esd transient return path to ground should be kept as short as possible. top cover tape carieer tape any additional label (if required) tsc label direction of feed w1 d1 d2 a for machine reference only including draft and radll concentric around b 0 t top cover tape see n ote 1 b0 k center lines of cavity f e w for components 2.0mm x 1.2mm and larger d' d p1 p 10 pitches cumulative tolerance on tape 2.0mm ( 0.008" ) b 0 embossment a 0 k 0 b 1 version : c11
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